Assignee
TAIWAN SEMICONDUCTOR MANUFATUR
TW·1 granted patent·1 pending application·25 citations·filing 1998–2003
Top patents by PatentIndex Score
2 records- 0156US6093619AMethod to form trench-free buried contact in process with STI technologyTAIWAN SEMICONDUCTOR MANUFATUR·Filed 1998·Granted Jul 25, 2000·25 cites·16 claims
- 0236US2004220996A1Multi-platform computer network and method of simplifying access to the multi-platform computer networkTAIWAN SEMICONDUCTOR MANUFATUR·Filed 2003·Application pending·0 cites
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