Assignee
TAIWAN SEMICONDUTOR MANUFACTUR
TW·2 granted patents·47 citations·filing 1998–1999
Top patents by PatentIndex Score
2 records- 0165US6090696AMethod to improve the adhesion of a molding compound to a semiconductor chip comprised with copper damascene structuresTAIWAN SEMICONDUTOR MANUFACTUR·Filed 1999·Granted Jul 18, 2000·33 cites·18 claims
- 0256US5914512AExternal contact to a MOSFET drain for testing of stacked-capacitor DRAMSTAIWAN SEMICONDUTOR MANUFACTUR·Filed 1998·Granted Jun 22, 1999·14 cites·6 claims
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