Assignee
TAIWAN SEMINCONDUCTOR MFG CO L
TW·5 granted patents·59 citations·filing 2003–2006
Top patents by PatentIndex Score
5 records- 0191US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
- 0266US6964419B2Chuck rollers and pins for substrate cleaning and drying systemTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2003·Granted Nov 15, 2005·13 cites·17 claims
- 0363US7241682B2Method of forming a dual damascene structureTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2004·Granted Jul 10, 2007·11 cites·15 claims
- 0457US7033947B2Dual trench alternating phase shift mask fabricationTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2003·Granted Apr 25, 2006·5 cites·13 claims
- 0539US7605413B2High voltage devicesTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Oct 20, 2009·0 cites·14 claims
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