Assignee
TAIYO HOLDINGS CO LTD
JP·15 granted patents·13 pending applications·4 citations·filing 2008–2025
Top patents by PatentIndex Score
28 records- 0176US7989561B2Composition of liquid, solid and semisolid epoxy resinsTAIYO HOLDINGS CO LTD·Filed 2008·Granted Aug 2, 2011·3 cites·12 claims
- 0265US2025289975A1Cured product and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2023·Application pending·0 cites
- 0364US9453137B2Photo-curable/thermally curable composition, method for manufacturing cured product thereof, cured product, and printed wiring board including the sameTAIYO HOLDINGS CO LTD·Filed 2013·Granted Sep 27, 2016·1 cites·21 claims
- 0462US2025216781A1Negative type photosensitive resin composition, dry film, cured product, and electronic componentTAIYO HOLDINGS CO LTD·Filed 2023·Application pending·0 cites
- 0561US2024400855A1Thermosetting resin composition, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 0658US12351686B2Curable resin composition, dry film and cured product of same, and electronic component containing said cured productTAIYO HOLDINGS CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·20 claims
- 0758US2024317702A1Xanthene compound and method for producing the sameTAIYO HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 0857US12043754B2Two-component type curable resin composition, product, dry film, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·17 claims
- 0957US2024287237A1Thermosetting resin composition, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2024·Application pending·0 cites
- 1056US12443101B2Cured coating filmTAIYO HOLDINGS CO LTD·Filed 2020·Granted Oct 14, 2025·0 cites·4 claims
- 1156US12319865B2Thermosetting resin composition, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·21 claims
- 1256US12054611B2Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic componentTAIYO HOLDINGS CO LTD·Filed 2019·Granted Aug 6, 2024·0 cites·19 claims
- 1355US12291604B2Curable resin composition, dry film and cured product thereof, and electronic component including cured productTAIYO HOLDINGS CO LTD·Filed 2020·Granted May 6, 2025·0 cites·20 claims
- 1455US2024417586A1Curable resin composition and process for producing printed wiring board using the sameTAIYO HOLDINGS CO LTD·Filed 2024·Application pending·0 cites
- 1554US12516182B2Resin composition, resin-attached metal foil, cured product, metal-based substrate, and electronic partTAIYO HOLDINGS CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 1653US2022382154A1Photosensitive resin composition, dry film, cured material and electronic componentTAIYO HOLDINGS CO LTD·Filed 2020·Application pending·0 cites
- 1752US12447725B2Curable resin multilayer body, dry film, cured product and electronic componentTAIYO HOLDINGS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·6 claims
- 1852US2024351939A1Substrate for mounting led and led-mounted substrateTAIYO HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 1949US9423691B2Layered structure and photosensitive dry film to be used thereforTAIYO HOLDINGS CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·13 claims
- 2049US2025304748A1Resin composition, dry film, and cured productTAIYO HOLDINGS CO LTD·Filed 2025·Application pending·0 cites
- 2148US11891474B2Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic componentTAIYO HOLDINGS CO LTD·Filed 2019·Granted Feb 6, 2024·0 cites·20 claims
- 2248US2025277085A1Resin composition, dry film, and cured productTAIYO HOLDINGS CO LTD·Filed 2025·Application pending·0 cites
- 2347US2022380538A1Curable composition including polyphenylene ether, dry film, prepreg, cured product, laminated board, and electronic componentTAIYO HOLDINGS CO LTD·Filed 2020·Application pending·0 cites
- 2445US11746227B2Thermosetting resin composition, cured product thereof, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2019·Granted Sep 5, 2023·0 cites·20 claims
- 2542US8042976B2White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting deviceTAIYO HOLDINGS CO LTD·Filed 2008·Granted Oct 25, 2011·0 cites·11 claims
- 2642US2026006718A1Structure body and wiring boardTAIYO HOLDINGS CO LTD·Filed 2023·Application pending·0 cites
- 2742US2024189859A1Ink-filled cartridgeTAIYO HOLDINGS CO LTD·Filed 2022·Application pending·0 cites
- 2841US9282644B2Photosensitive resin composition, cured product thereof, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2014·Granted Mar 8, 2016·0 cites·18 claims
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