Assignee
TAIYO INK MFG CO LTD
JP·64 granted patents·25 pending applications·1,262 citations·filing 1988–2022
Top patents by PatentIndex Score
89 records- 0192US4943516APhotosensitive thermosetting resin composition and method of forming solder resist pattern by use thereofTAIYO INK MFG CO LTD·Filed 1988·Granted Jul 24, 1990·99 cites·28 claims
- 0290US10005911B2Curable composition for printed wiring board, and cured coating and printed wiring board using sameTAIYO INK MFG CO LTD·Filed 2014·Granted Jun 26, 2018·7 cites·20 claims
- 0390US5837155AInsulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the compositionTAIYO INK MFG CO LTD·Filed 1996·Granted Nov 17, 1998·116 cites·30 claims
- 0489US7585611B2Photocurable and thermosetting resin composition, dry film using the same, and cured product thereofTAIYO INK MFG CO LTD·Filed 2007·Granted Sep 8, 2009·14 cites·18 claims
- 0589US6555594B1Photo-curable electrically conductive composition and plasma display panel having electrodes formed by use of the sameTAIYO INK MFG CO LTD·Filed 2000·Granted Apr 29, 2003·55 cites·13 claims
- 0688US7462653B2Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereofTAIYO INK MFG CO LTD·Filed 2005·Granted Dec 9, 2008·11 cites·6 claims
- 0788US5840465ACompositions and method for formation of barrier ribs of plasma display panelTAIYO INK MFG CO LTD·Filed 1995·Granted Nov 24, 1998·83 cites·33 claims
- 0887US5009982AResist ink compositionTAIYO INK MFG CO LTD·Filed 1988·Granted Apr 23, 1991·94 cites·15 claims
- 0986US11535766B2Curable composition for inkjet printing, cured product of same, and electronic component having the cured productTAIYO INK MFG CO LTD·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 1085US5972564AAlkali development type photocurable conductive paste composition and plasma display panels having electrodes formed thereofTAIYO INK MFG CO LTD·Filed 1998·Granted Oct 26, 1999·69 cites·12 claims
- 1184US5948514APhotocurable thermosettting resin composition developable with aqueous alkali solutionTAIYO INK MFG CO LTD·Filed 1996·Granted Sep 7, 1999·92 cites·18 claims
- 1282US9822226B2Dry film and printed wiring boardTAIYO INK MFG CO LTD·Filed 2015·Granted Nov 21, 2017·3 cites·19 claims
- 1381US6793850B2Alkali development type photocurable composition and calcined pattern obtained by use of the sameTAIYO INK MFG CO LTD·Filed 2002·Granted Sep 21, 2004·21 cites·16 claims
- 1481US6312864B1Methods for production of patterned calcined inorganic filmTAIYO INK MFG CO LTD·Filed 2000·Granted Nov 6, 2001·27 cites·10 claims
- 1579US7825198B2Thermosetting resin composition and multilayer printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2006·Granted Nov 2, 2010·4 cites·7 claims
- 1679US6338936B1Photosensitive resin composition and method for formation of resist pattern by use thereofTAIYO INK MFG CO LTD·Filed 1999·Granted Jan 15, 2002·40 cites·27 claims
- 1777US9188871B2Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereofTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 17, 2015·3 cites·17 claims
- 1877US7829180B2Composition for forming adhesive pattern, laminated structure obtained by using same, and method of producing such laminated structureTAIYO INK MFG CO LTD·Filed 2007·Granted Nov 9, 2010·6 cites·7 claims
- 1977US7105256B2Photosensitive conductive composition and plasma display panel formed by using the sameTAIYO INK MFG CO LTD·Filed 2004·Granted Sep 12, 2006·15 cites·19 claims
- 2077US6773855B1Low-radiation, photocurable and thermosetting resin composition and cured film thereofTAIYO INK MFG CO LTD·Filed 2003·Granted Aug 10, 2004·23 cites·10 claims
- 2177US6342322B1Photosensitive composition and calcined pattern obtained by use thereofTAIYO INK MFG CO LTD·Filed 1999·Granted Jan 29, 2002·47 cites·16 claims
- 2277US5753722APhotocurable and thermosetting matte liquid resist compositionTAIYO INK MFG CO LTD·Filed 1996·Granted May 19, 1998·47 cites·17 claims
- 2376US6576409B2Photosensitive resin composition and method for formation of resist pattern by use thereofTAIYO INK MFG CO LTD·Filed 2002·Granted Jun 10, 2003·15 cites·2 claims
- 2475US9182665B2White curable composition for printed circuit board, cured coating film using the same, and printed circuit boardTAIYO INK MFG CO LTD·Filed 2014·Granted Nov 10, 2015·2 cites·20 claims
- 2575US9068100B2Thermosetting resin composition, cured product thereof, and printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2012·Granted Jun 30, 2015·2 cites·17 claims
- 2675US5620831ACyanoguanidine derivatives, and thermosetting or photocurable, thermosetting resin composition using the sameTAIYO INK MFG CO LTD·Filed 1995·Granted Apr 15, 1997·20 cites·30 claims
- 2773US7648814B2Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formedTAIYO INK MFG CO LTD·Filed 2008·Granted Jan 19, 2010·3 cites·16 claims
- 2873US7517632B2Silver paste composition, method of forming conductive pattern by using the same, and the conductive pattern formedTAIYO INK MFG CO LTD·Filed 2008·Granted Apr 14, 2009·5 cites·16 claims
- 2972US6906116B2Unsaturated polyester compounds, resins curable with actinic energy ray, processes for the production thereof, and curable compositionsTAIYO INK MFG CO LTD·Filed 2003·Granted Jun 14, 2005·10 cites·20 claims
- 3072US6120975AMethods for production of a plasma display panelTAIYO INK MFG CO LTD·Filed 1998·Granted Sep 19, 2000·37 cites·28 claims
- 3171US5677450AOrganic acid salt of melamine, and thermosetting or photocurable, thermosetting coating composition using the sameTAIYO INK MFG CO LTD·Filed 1996·Granted Oct 14, 1997·14 cites·8 claims
- 3270US9497856B2Laminated structure, dry film and method of producing laminated structureTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 15, 2016·1 cites·17 claims
- 3370US5604080AOrganic acid salt of melamine, and thermosetting or photocurable thermosetting coating composition using the sameTAIYO INK MFG CO LTD·Filed 1995·Granted Feb 18, 1997·14 cites·16 claims
- 3469US9596754B2Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrateTAIYO INK MFG CO LTD·Filed 2012·Granted Mar 14, 2017·4 cites·20 claims
- 3569US6326125B1Photosensitive composition and calcined pattern obtained by use thereofTAIYO INK MFG CO LTD·Filed 1999·Granted Dec 4, 2001·29 cites·27 claims
- 3668US9388308B2Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the sameTAIYO INK MFG CO LTD·Filed 2013·Granted Jul 12, 2016·1 cites·20 claims
- 3768US7057063B2Unsaturated carboxylic ester compound, process for producing the same, and composition curable with actinic energy rayTAIYO INK MFG CO LTD·Filed 2002·Granted Jun 6, 2006·4 cites·2 claims
- 3867US6824858B2Photocurable/thermosetting composition for forming matte filmTAIYO INK MFG CO LTD·Filed 2002·Granted Nov 30, 2004·16 cites·23 claims
- 3967US5741622AOne-package photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereofTAIYO INK MFG CO LTD·Filed 1996·Granted Apr 21, 1998·29 cites·40 claims
- 4066US10113066B2Curable composition, cured coating film using same, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2014·Granted Oct 30, 2018·1 cites·20 claims
- 4166US7718714B2Resin curable with actinic energy ray, photocurable and thermosetting resin composition containing the same, and cured product obtained therefromTAIYO INK MFG CO LTD·Filed 2006·Granted May 18, 2010·1 cites·20 claims
- 4266US7226710B2Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the sameTAIYO INK MFG CO LTD·Filed 2004·Granted Jun 5, 2007·8 cites·9 claims
- 4366US6103452APhotosensitive composition and calcined pattern obtained by use thereofTAIYO INK MFG CO LTD·Filed 1999·Granted Aug 15, 2000·29 cites·17 claims
- 4465US5770347APhotocurable and thermosetting coating composition and method for formation of solder mask for printed circuit boardTAIYO INK MFG CO LTD·Filed 1995·Granted Jun 23, 1998·29 cites·17 claims
- 4564US9265156B2Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured filmTAIYO INK MFG CO LTD·Filed 2014·Granted Feb 16, 2016·1 cites·20 claims
- 4664US2024018295A1Thermosetting resin composition, cured product, and printed wiring boardTAIYO INK MFG CO LTD·Filed 2021·Application pending·0 cites
- 4763US7132168B2Resin curable with actinic radiation, process for the production thereof, and photocurable and thermosetting resin compositionTAIYO INK MFG CO LTD·Filed 2004·Granted Nov 7, 2006·4 cites·5 claims
- 4861US6132937AAlkali-developing type photocurable composition and calcined pattern obtained by use thereofTAIYO INK MFG CO LTD·Filed 1999·Granted Oct 17, 2000·25 cites·20 claims
- 4960US6518331B2Composition of epoxy resins and curing agent capable of being coarsenedTAIYO INK MFG CO LTD·Filed 2000·Granted Feb 11, 2003·7 cites·13 claims
- 5058US9298096B2Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured productTAIYO INK MFG CO LTD·Filed 2014·Granted Mar 29, 2016·1 cites·13 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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