Assignee
TAKAHASHI TAKUYA
JP·4 granted patents·15 citations·filing 2010–2023
Top patents by PatentIndex Score
4 records- 0173US8602811B2Connector assembly including first connector and second connector configured to be mounted on a circuit board and easily matedTAKAHASHI TAKUYA·Filed 2011·Granted Dec 10, 2013·9 cites·11 claims
- 0269US8647129B2Housingless connectorTAKAHASHI TAKUYA·Filed 2012·Granted Feb 11, 2014·6 cites·9 claims
- 0361US12519923B2Display terminal, communication system, display method, and communication methodTAKAHASHI TAKUYA·Filed 2023·Granted Jan 6, 2026·0 cites·13 claims
- 0431US8450858B2Method of manufacturing semiconductor device including wiring layout and semiconductor deviceTAKAHASHI TAKUYA·Filed 2010·Granted May 28, 2013·0 cites·4 claims
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