Assignee
TAKANASHI HIROSHI
JP·1 granted patent·9 pending applications·3 citations·filing 2005–2010
Top patents by PatentIndex Score
10 records- 0171US9090783B2Protective film agent for laser dicing and wafer processing method using the protective film agentTAKANASHI HIROSHI·Filed 2010·Granted Jul 28, 2015·3 cites·5 claims
- 0253US2010055612A1Nagative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2009·Application pending·0 cites
- 0353US2010068480A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2009·Application pending·0 cites
- 0452US2009075200A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2008·Application pending·0 cites
- 0550US2008070160A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2007·Application pending·0 cites
- 0648US2007111141A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2006·Application pending·0 cites
- 0747US2006275702A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2006·Application pending·0 cites
- 0846US2006057495A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2005·Application pending·0 cites
- 0946US2006147838A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2006·Application pending·0 cites
- 1043US2009068413A1Negative-working photosensitive resin composition and photosensitive resin plate using the sameTAKANASHI HIROSHI·Filed 2007·Application pending·0 cites
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