Assignee
TAKANO AKIHITO
JP·4 granted patents·15 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0177US8669643B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Mar 11, 2014·5 cites·11 claims
- 0276US8058717B2Laminated body of semiconductor chips including pads mutually connected to conductive memberTAKANO AKIHITO·Filed 2010·Granted Nov 15, 2011·5 cites·7 claims
- 0373US8810007B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Aug 19, 2014·4 cites·12 claims
- 0456US8101461B2Stacked semiconductor device and method of manufacturing the sameTAKANO AKIHITO·Filed 2009·Granted Jan 24, 2012·1 cites·11 claims
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