Assignee
TAKEDA TSUTOMU
JP·4 granted patents·17 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0182US8604357B2Wiring board having via and method forming a via in a wiring boardTAKEDA TSUTOMU·Filed 2009·Granted Dec 10, 2013·14 cites·6 claims
- 0272US8507807B2Wiring boardTAKEDA TSUTOMU·Filed 2011·Granted Aug 13, 2013·3 cites·2 claims
- 0356US9028746B2Build-up welding material, deposited metal, and member with deposited metalTAKEDA TSUTOMU·Filed 2011·Granted May 12, 2015·0 cites·13 claims
- 0437US9136210B2Interposer and semiconductor deviceTAKEDA TSUTOMU·Filed 2011·Granted Sep 15, 2015·0 cites·8 claims
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