Assignee
TANAKA NOBUKI
JP·1 granted patent·1 pending application·5 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0184US8852734B2Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor deviceTANAKA NOBUKI·Filed 2010·Granted Oct 7, 2014·5 cites·12 claims
- 0240US2011194261A1Prepreg, laminate, printed wiring board, and semiconductor deviceTANAKA NOBUKI·Filed 2011·Application pending·0 cites
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