Assignee
TANAKA TAKEKAZU
JP·3 granted patents·12 citations·filing 2008–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0185US8395261B2Semiconductor deviceTANAKA TAKEKAZU·Filed 2012·Granted Mar 12, 2013·6 cites·13 claims
- 0273US8299620B2Semiconductor device with welded leads and method of manufacturing the sameTANAKA TAKEKAZU·Filed 2008·Granted Oct 30, 2012·6 cites·2 claims
- 0350US8334596B2Semiconductor device including coupling ball with layers of aluminum and copper alloysTANAKA TAKEKAZU·Filed 2011·Granted Dec 18, 2012·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when TANAKA TAKEKAZU files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →