Assignee
TANG JINBANG
US·11 granted patents·4 pending applications·63 citations·filing 2007–2013
Top patents by PatentIndex Score
15 records- 0195US8407890B2Method of manufacting an electronic device module with integrated antenna structureTANG JINBANG·Filed 2010·Granted Apr 2, 2013·19 cites·17 claims
- 0291US8283764B2Microelectronic assembly with an embedded waveguide adapter and method for forming the sameTANG JINBANG·Filed 2012·Granted Oct 9, 2012·12 cites·20 claims
- 0384US8293588B2Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layerTANG JINBANG·Filed 2011·Granted Oct 23, 2012·6 cites·20 claims
- 0483US8097494B2Method of making an integrated circuit package with shielding via ring structureTANG JINBANG·Filed 2010·Granted Jan 17, 2012·6 cites·16 claims
- 0579US8093700B2Packaging millimeter wave modulesTANG JINBANG·Filed 2008·Granted Jan 10, 2012·8 cites·14 claims
- 0677US8168464B2Microelectronic assembly with an embedded waveguide adapter and method for forming the sameTANG JINBANG·Filed 2010·Granted May 1, 2012·4 cites·20 claims
- 0776US9172143B2Electronic device module with integrated antenna structure, and related manufacturing methodTANG JINBANG·Filed 2013·Granted Oct 27, 2015·3 cites·20 claims
- 0868US8330239B2Shielding for a micro electro-mechanical device and method thereforTANG JINBANG·Filed 2009·Granted Dec 11, 2012·3 cites·13 claims
- 0967US8461657B2Methods for forming a micro electro-mechanical deviceTANG JINBANG·Filed 2012·Granted Jun 11, 2013·1 cites·17 claims
- 1063US8290736B2Calibration standards and methods of their fabrication and useTANG JINBANG·Filed 2010·Granted Oct 16, 2012·1 cites·25 claims
- 1153US8385084B2Shielding structures for signal paths in electronic devicesTANG JINBANG·Filed 2010·Granted Feb 26, 2013·0 cites·15 claims
- 1244US2015187675A1Methods and apparatus for dissipating heat from a die assemblyTANG JINBANG·Filed 2013·Application pending·0 cites
- 1344US2008315376A1Conformal EMI shielding with enhanced reliabilityTANG JINBANG·Filed 2007·Application pending·0 cites
- 1444US2009072357A1Integrated shielding process for precision high density module packagingTANG JINBANG·Filed 2007·Application pending·0 cites
- 1539US2013330846A1Test vehicles for encapsulated semiconductor device packagesTANG JINBANG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →