Assignee
TECHNOLOGIES GROUP INC H
US·2 granted patents·1 pending application·159 citations·filing 1996–2001
Top patents by PatentIndex Score
3 records- 0187US6176947B1Lead-free soldersTECHNOLOGIES GROUP INC H·Filed 1999·Granted Jan 23, 2001·100 cites·10 claims
- 0285US5985212AHigh strength lead-free solder materialsTECHNOLOGIES GROUP INC H·Filed 1996·Granted Nov 16, 1999·59 cites·1 claims
- 0339US2002155024A1Lead-free solder compositionsTECHNOLOGIES GROUP INC H·Filed 2001·Application pending·0 cites
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