Assignee

TEE TONG YAN

SG·2 granted patents·13 citations·filing 2007–2012

Technology mixH10W2 Y10S2

Top patents by PatentIndex Score

2 records

0185US8486824B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2012·Granted Jul 16, 2013·11 cites·20 claims
0257US8217518B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2007·Granted Jul 10, 2012·2 cites·17 claims

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