Assignee
TEH WENG HONG
US·9 granted patents·3 pending applications·50 citations·filing 2011–2013
Top patents by PatentIndex Score
12 records- 0196US8633551B1Semiconductor package with mechanical fuseTEH WENG HONG·Filed 2012·Granted Jan 21, 2014·30 cites·30 claims
- 0287US8937382B2Secondary device integration into coreless microelectronic device packagesTEH WENG HONG·Filed 2011·Granted Jan 20, 2015·8 cites·5 claims
- 0381US9490196B2Multi die package having a die and a spacer layer in a recessTEH WENG HONG·Filed 2011·Granted Nov 8, 2016·4 cites·9 claims
- 0479US9520350B2Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layerTEH WENG HONG·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 0571US9601421B2BBUL material integration in-plane with embedded die for warpage controlTEH WENG HONG·Filed 2011·Granted Mar 21, 2017·3 cites·11 claims
- 0649US9708178B2Integration of laminate MEMS in BBUL coreless packageTEH WENG HONG·Filed 2011·Granted Jul 18, 2017·0 cites·15 claims
- 0744US9505610B2Device, system and method for providing MEMS structures of a semiconductor packageTEH WENG HONG·Filed 2013·Granted Nov 29, 2016·0 cites·19 claims
- 0843US9299660B2Controlled solder-on-die integrations on packages and methods of assembling sameTEH WENG HONG·Filed 2011·Granted Mar 29, 2016·0 cites·23 claims
- 0943US9162867B2Through-silicon via resonators in chip packages and methods of assembling sameTEH WENG HONG·Filed 2011·Granted Oct 20, 2015·0 cites·7 claims
- 1043US2015002984A1Method of forming a magnetic mems tunable capacitorTEH WENG HONG·Filed 2013·Application pending·0 cites
- 1142US2015217995A1Arrangement of through-hole structures of a semiconductor packageTEH WENG HONG·Filed 2013·Application pending·0 cites
- 1241US2014001583A1Method to inhibit metal-to-metal stiction issues in mems fabricationTEH WENG HONG·Filed 2012·Application pending·0 cites
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