Assignee
TERAO HOSHIAKI
JP·2 granted patents·3 citations·filing 2007–2010
Top patents by PatentIndex Score
2 records- 0158US9299636B2Heat sink for electronic device and process for production thereofTERAO HOSHIAKI·Filed 2010·Granted Mar 29, 2016·3 cites·16 claims
- 0239US8557015B2Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductorTERAO HOSHIAKI·Filed 2007·Granted Oct 15, 2013·0 cites·4 claims
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