Assignee
TESSERA TECH HUNGARY KFT
HU·11 granted patents·1 pending application·552 citations·filing 2001–2007
Top patents by PatentIndex Score
12 records- 0197US7265440B2Methods and apparatus for packaging integrated circuit devicesTESSERA TECH HUNGARY KFT·Filed 2005·Granted Sep 4, 2007·70 cites·18 claims
- 0296US7495341B2Methods and apparatus for packaging integrated circuit devicesTESSERA TECH HUNGARY KFT·Filed 2007·Granted Feb 24, 2009·55 cites·23 claims
- 0395US7642629B2Methods and apparatus for packaging integrated circuit devicesTESSERA TECH HUNGARY KFT·Filed 2007·Granted Jan 5, 2010·39 cites·7 claims
- 0494US7192796B2Methods and apparatus for packaging integrated circuit devicesTESSERA TECH HUNGARY KFT·Filed 2004·Granted Mar 20, 2007·86 cites·23 claims
- 0593US7807508B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH HUNGARY KFT·Filed 2007·Granted Oct 5, 2010·62 cites·21 claims
- 0693US7157742B2Integrated circuit deviceTESSERA TECH HUNGARY KFT·Filed 2003·Granted Jan 2, 2007·53 cites·6 claims
- 0792US7033664B2Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced therebyTESSERA TECH HUNGARY KFT·Filed 2002·Granted Apr 25, 2006·92 cites·37 claims
- 0890US7144745B2Methods for producing packaged integrated circuit devices and packaged integrated circuit devices producedTESSERA TECH HUNGARY KFT·Filed 2001·Granted Dec 5, 2006·53 cites·42 claims
- 0989US7479398B2Methods and apparatus for packaging integrated circuit devicesTESSERA TECH HUNGARY KFT·Filed 2007·Granted Jan 20, 2009·15 cites·21 claims
- 1081US7408249B2Packaged integrated circuits and methods of producing thereofTESSERA TECH HUNGARY KFT·Filed 2001·Granted Aug 5, 2008·26 cites·22 claims
- 1167US7781240B2Integrated circuit deviceTESSERA TECH HUNGARY KFT·Filed 2006·Granted Aug 24, 2010·1 cites·27 claims
- 1240US2007190747A1Wafer level packaging to lidded chipsTESSERA TECH HUNGARY KFT·Filed 2007·Application pending·0 cites
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