Assignee
TEXAS INSTRUMENTS JAPAN
JP·7 granted patents·431 citations·filing 1989–2004
Top patents by PatentIndex Score
7 records- 0193US5882956AProcess for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1997·Granted Mar 16, 1999·161 cites·9 claims
- 0290US7023088B2Semiconductor package, semiconductor device and electronic deviceTEXAS INSTRUMENTS JAPAN·Filed 2003·Granted Apr 4, 2006·53 cites·9 claims
- 0388US6007920AWafer dicing/bonding sheet and process for producing semiconductor deviceTEXAS INSTRUMENTS JAPAN·Filed 1998·Granted Dec 28, 1999·92 cites·5 claims
- 0487US7157363B2Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portionTEXAS INSTRUMENTS JAPAN·Filed 2004·Granted Jan 2, 2007·39 cites·11 claims
- 0572US5153897AAutomatically controlling the operation mode of data circuit terminating equipment in a communication systemTEXAS INSTRUMENTS JAPAN·Filed 1989·Granted Oct 6, 1992·49 cites·20 claims
- 0668US5650801ADrive circuit with rise and fall time equalizationTEXAS INSTRUMENTS JAPAN·Filed 1995·Granted Jul 22, 1997·34 cites·3 claims
- 0731US6469570B1Voltage supply circuitTEXAS INSTRUMENTS JAPAN·Filed 2000·Granted Oct 22, 2002·3 cites·4 claims
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