Assignee
THEMIS COMP
US·2 granted patents·2 pending applications·77 citations·filing 2002–2008
Technology mixH05K4
Top patents by PatentIndex Score
4 records- 0189US6765793B2Ruggedized electronics enclosureTHEMIS COMP·Filed 2002·Granted Jul 20, 2004·45 cites·71 claims
- 0286US6944022B1Ruggedized electronics enclosureTHEMIS COMP·Filed 2004·Granted Sep 13, 2005·32 cites·8 claims
- 0352US2008218970A1Thermal Management for a Ruggedized Electronics EnclosureTHEMIS COMP·Filed 2008·Application pending·0 cites
- 0446US2008174960A1Clamshell enclosure for electronic circuit assembliesTHEMIS COMP·Filed 2008·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →