Assignee
THERMAGON INC
US·6 granted patents·287 citations·filing 2000–2004
Top patents by PatentIndex Score
6 records- 0193US6372997B1Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2000·Granted Apr 16, 2002·95 cites·8 claims
- 0287US7369411B2Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2004·Granted May 6, 2008·51 cites·8 claims
- 0386US7078109B2Heat spreading thermal interface structureTHERMAGON INC·Filed 2004·Granted Jul 18, 2006·48 cites·8 claims
- 0485US6761928B2Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2002·Granted Jul 13, 2004·38 cites·10 claims
- 0585US6617517B2Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sinkTHERMAGON INC·Filed 2002·Granted Sep 9, 2003·32 cites·5 claims
- 0676US6849941B1Heat sink and heat spreader assemblyTHERMAGON INC·Filed 2004·Granted Feb 1, 2005·23 cites·7 claims
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