Assignee
THIE WILLIAM
US·5 granted patents·14 citations·filing 2007–2011
Top patents by PatentIndex Score
5 records- 0190US8622020B2Simultaneous electroless plating of two substratesTHIE WILLIAM·Filed 2010·Granted Jan 7, 2014·10 cites·17 claims
- 0268US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 0361US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 0457US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 0543US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
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