Assignee
TOHOKU MICROTEC CO LTD
JP·8 granted patents·1 pending application·14 citations·filing 2014–2023
Top patents by PatentIndex Score
9 records- 0187US10115649B1External connection mechanism, semiconductor device, and stacked packageTOHOKU MICROTEC CO LTD·Filed 2017·Granted Oct 30, 2018·4 cites·5 claims
- 0284US9219047B2Stacked device and method of manufacturing the sameTOHOKU MICROTEC CO LTD·Filed 2014·Granted Dec 22, 2015·7 cites·17 claims
- 0381US10115695B1Solid-state imaging deviceTOHOKU MICROTEC CO LTD·Filed 2017·Granted Oct 30, 2018·3 cites·11 claims
- 0464US12463078B2Micro-element, alignment system and assembling methodTOHOKU MICROTEC CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·4 claims
- 0555US12327742B2Alignment-assisting tray, alignment-control apparatus and alignment methodTOHOKU MICROTEC CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·2 claims
- 0654US12327818B2Stacked semiconductor deviceTOHOKU MICROTEC CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·4 claims
- 0752US11462668B2Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor deviceTOHOKU MICROTEC CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 0845US11495565B2Stacked semiconductor device and multiple chips used thereinTOHOKU MICROTEC CO LTD·Filed 2019·Granted Nov 8, 2022·0 cites·10 claims
- 0933US2015282709A1Brain electrode systemTOHOKU MICROTEC CO LTD·Filed 2015·Application pending·0 cites
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