Assignee
TOKYO SEIMITSU CO LTD
US·306 granted patents·77 pending applications·4,416 citations·filing 1976–2025
Top patents by PatentIndex Score
383 records- 0197US11859969B2Measurement deviceTOKYO SEIMITSU CO LTD·Filed 2022·Granted Jan 2, 2024·6 cites·5 claims
- 0294US6580502B1Appearance inspection method and apparatusTOKYO SEIMITSU CO LTD·Filed 2000·Granted Jun 17, 2003·84 cites·13 claims
- 0393US11504869B2Workpiece processing device and methodTOKYO SEIMITSU CO LTD·Filed 2021·Granted Nov 22, 2022·2 cites·4 claims
- 0493US7753761B2Wafer polishing apparatus and wafer polishing methodTOKYO SEIMITSU CO LTD·Filed 2006·Granted Jul 13, 2010·18 cites·13 claims
- 0593US6030326AAutomatic blade changing systemTOKYO SEIMITSU CO LTD·Filed 1998·Granted Feb 29, 2000·68 cites·14 claims
- 0692US10732220B2Positioning and fixing deviceTOKYO SEIMITSU CO LTD·Filed 2017·Granted Aug 4, 2020·14 cites·5 claims
- 0792US6267648B1Apparatus and method for chamfering waferTOKYO SEIMITSU CO LTD·Filed 1999·Granted Jul 31, 2001·152 cites·21 claims
- 0891US11435175B2Displacement detector, surface shape measuring apparatus, and roundness measuring apparatusTOKYO SEIMITSU CO LTD·Filed 2021·Granted Sep 6, 2022·2 cites·18 claims
- 0991US9921049B2Three-dimensional coordinate measurement apparatusTOKYO SEIMITSU CO LTD·Filed 2017·Granted Mar 20, 2018·6 cites·3 claims
- 1091US9074865B2Contour and surface texture measuring instrument and contour and surface texture measuring methodTOKYO SEIMITSU CO LTD·Filed 2012·Granted Jul 7, 2015·12 cites·7 claims
- 1191US6426275B1Method for manufacturing semiconductor chips using protecting pricing and separating sheetsTOKYO SEIMITSU CO LTD·Filed 2000·Granted Jul 30, 2002·121 cites·6 claims
- 1291US5433649ABlade position detection apparatusTOKYO SEIMITSU CO LTD·Filed 1994·Granted Jul 18, 1995·71 cites·3 claims
- 1390US11940463B2Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement methodTOKYO SEIMITSU CO LTD·Filed 2023·Granted Mar 26, 2024·2 cites·20 claims
- 1490US10571238B2Detector for surface measuring deviceTOKYO SEIMITSU CO LTD·Filed 2019·Granted Feb 25, 2020·5 cites·9 claims
- 1590US6431964B1Planarization apparatus and methodTOKYO SEIMITSU CO LTD·Filed 2000·Granted Aug 13, 2002·51 cites·35 claims
- 1690US6196905B1Wafer polishing apparatus with retainer ringTOKYO SEIMITSU CO LTD·Filed 2000·Granted Mar 6, 2001·34 cites·2 claims
- 1790US5628301AWire traverse apparatus of wire sawTOKYO SEIMITSU CO LTD·Filed 1996·Granted May 13, 1997·47 cites·3 claims
- 1889US11472055B2Workpiece processing device and methodTOKYO SEIMITSU CO LTD·Filed 2021·Granted Oct 18, 2022·2 cites·12 claims
- 1989US9372099B2Angle measuring method and angle measuring systemTOKYO SEIMITSU CO LTD·Filed 2015·Granted Jun 21, 2016·3 cites·7 claims
- 2089US6511363B2Polishing end point detecting device for wafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2001·Granted Jan 28, 2003·73 cites·43 claims
- 2189US5658189AGrinding apparatus for wafer edgeTOKYO SEIMITSU CO LTD·Filed 1995·Granted Aug 19, 1997·103 cites·6 claims
- 2288US10173296B2Grinding machineTOKYO SEIMITSU CO LTD·Filed 2016·Granted Jan 8, 2019·3 cites·4 claims
- 2388US7981770B2Wafer machining method for preparing a wafer for dicingTOKYO SEIMITSU CO LTD·Filed 2007·Granted Jul 19, 2011·12 cites·8 claims
- 2488US6690991B1Machine control gage system performing roundness measuring functionTOKYO SEIMITSU CO LTD·Filed 2000·Granted Feb 10, 2004·42 cites·20 claims
- 2588US6583032B1Method for manufacturing semiconductor chipsTOKYO SEIMITSU CO LTD·Filed 2000·Granted Jun 24, 2003·44 cites·8 claims
- 2688US6431949B1Planarization apparatusTOKYO SEIMITSU CO LTD·Filed 2000·Granted Aug 13, 2002·35 cites·6 claims
- 2787US9354088B2Rotation angle measurement device and rotation angle measurement methodTOKYO SEIMITSU CO LTD·Filed 2013·Granted May 31, 2016·5 cites·16 claims
- 2887US7290348B2Device for measuring circularity and cylindrical shapeTOKYO SEIMITSU CO LTD·Filed 2005·Granted Nov 6, 2007·19 cites·8 claims
- 2987US6969308B2Method and apparatus for chemical and mechanical polishingTOKYO SEIMITSU CO LTD·Filed 2003·Granted Nov 29, 2005·38 cites·5 claims
- 3087US6059636AWafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted May 9, 2000·73 cites·3 claims
- 3187US5931725AWafer polishing machineTOKYO SEIMITSU CO LTD·Filed 1997·Granted Aug 3, 1999·100 cites·5 claims
- 3287US5816895ASurface grinding method and apparatusTOKYO SEIMITSU CO LTD·Filed 1997·Granted Oct 6, 1998·78 cites·6 claims
- 3386US8043140B2Wafer polishing apparatus and wafer polishing methodTOKYO SEIMITSU CO LTD·Filed 2008·Granted Oct 25, 2011·9 cites·8 claims
- 3485US10724841B2Detector, surface property measuring machine, and roundness measuring machineTOKYO SEIMITSU CO LTD·Filed 2019·Granted Jul 28, 2020·3 cites·10 claims
- 3585US10041779B2Surface shape measuring method, misalignment amount calculating method, and surface shape measuring deviceTOKYO SEIMITSU CO LTD·Filed 2018·Granted Aug 7, 2018·6 cites·6 claims
- 3685US6519357B2Appearance inspection machine and method for concurrently performing defect detection and classificationTOKYO SEIMITSU CO LTD·Filed 1999·Granted Feb 11, 2003·98 cites·18 claims
- 3784US11365959B2Three-dimensional measuring system, and three-dimensional measuring methodTOKYO SEIMITSU CO LTD·Filed 2021·Granted Jun 21, 2022·3 cites·44 claims
- 3884US11025151B2Linear drive mechanism and shape measuring machineTOKYO SEIMITSU CO LTD·Filed 2020·Granted Jun 1, 2021·1 cites·11 claims
- 3983US7632169B2Polishing method and polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2007·Granted Dec 15, 2009·7 cites·13 claims
- 4083US7405584B2Prober and probe contact methodTOKYO SEIMITSU CO LTD·Filed 2007·Granted Jul 29, 2008·16 cites·6 claims
- 4183US7330265B2Appearance inspection apparatus and projection method for projecting image of sample under inspectionTOKYO SEIMITSU CO LTD·Filed 2005·Granted Feb 12, 2008·10 cites·6 claims
- 4282US10950471B2Laser machining device and laser machining methodTOKYO SEIMITSU CO LTD·Filed 2020·Granted Mar 16, 2021·6 cites·20 claims
- 4382US9829303B2Shape measuring apparatusTOKYO SEIMITSU CO LTD·Filed 2017·Granted Nov 28, 2017·3 cites·15 claims
- 4482US9664733B2Probe device for testing electrical characteristics of semiconductor elementTOKYO SEIMITSU CO LTD·Filed 2015·Granted May 30, 2017·3 cites·9 claims
- 4582US9581424B2Roundness measuring apparatusTOKYO SEIMITSU CO LTD·Filed 2014·Granted Feb 28, 2017·8 cites·1 claims
- 4682US7503365B2Dicing tape attaching apparatus and dicing tape attaching methodTOKYO SEIMITSU CO LTD·Filed 2006·Granted Mar 17, 2009·8 cites·7 claims
- 4782US7366343B2Pattern inspection method and apparatusTOKYO SEIMITSU CO LTD·Filed 2004·Granted Apr 29, 2008·21 cites·9 claims
- 4882US6734083B2Dicing method and dicing apparatus for dicing plate-like workpieceTOKYO SEIMITSU CO LTD·Filed 2002·Granted May 11, 2004·27 cites·8 claims
- 4982US6280308B1Wafer suction padTOKYO SEIMITSU CO LTD·Filed 2000·Granted Aug 28, 2001·30 cites·7 claims
- 5082US6033292AWafer polishing apparatus with retainer ringTOKYO SEIMITSU CO LTD·Filed 1998·Granted Mar 7, 2000·46 cites·5 claims
Showing the top 50 of 383 patent records by PatentIndex Score.
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