Assignee
TOMIZAWA HIDEYUKI
US·1 granted patent·2 pending applications·0 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0134US2014027914A1Protection of under-layer conductive pathwayTOMIZAWA HIDEYUKI·Filed 2012·Application pending·0 cites
- 0233US8614510B2Semiconductor device including a metal wiring with a metal capTOMIZAWA HIDEYUKI·Filed 2010·Granted Dec 24, 2013·0 cites·8 claims
- 0332US2013161798A1Graded density layer for formation of interconnect structuresTOMIZAWA HIDEYUKI·Filed 2011·Application pending·0 cites
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