Assignee
TONG HSING ELECTRIC IND LTD
TW·4 granted patents·5 pending applications·5 citations·filing 2002–2009
Top patents by PatentIndex Score
9 records- 0160US7934306B2Method for packaging micro electromechanical systems microphoneTONG HSING ELECTRIC IND LTD·Filed 2009·Granted May 3, 2011·3 cites·12 claims
- 0241US2011057216A1Low profile optoelectronic device packageTONG HSING ELECTRIC IND LTD·Filed 2009·Application pending·0 cites
- 0339US2008316716A1Frame for a packaging method using flexible printed circuit boards and method thereofTONG HSING ELECTRIC IND LTD·Filed 2007·Application pending·0 cites
- 0437US6903456B2Package carrier having multiple individual ceramic substratesTONG HSING ELECTRIC IND LTD·Filed 2003·Granted Jun 7, 2005·1 cites·4 claims
- 0536US6800211B2Method for removing voids in a ceramic substrateTONG HSING ELECTRIC IND LTD·Filed 2002·Granted Oct 5, 2004·1 cites·1 claims
- 0636US2006096780A1Thin film circuit integrating thick film resistors thereonTONG HSING ELECTRIC IND LTD·Filed 2005·Application pending·0 cites
- 0732US7100270B2Method of fabricating a thin film integrated circuit with thick film resistorsTONG HSING ELECTRIC IND LTD·Filed 2003·Granted Sep 5, 2006·0 cites·6 claims
- 0829US2006024901A1Method for fabricating a high-frequency and high-power semiconductor moduleTONG HSING ELECTRIC IND LTD·Filed 2004·Application pending·0 cites
- 0928US2008315383A1Chip frame for optical digital processorTONG HSING ELECTRIC IND LTD·Filed 2007·Application pending·0 cites
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