Assignee
TONG HSING ELECTRONIC IND LTD
TW·2 granted patents·0 citations·filing 2023–2023
Top patents by PatentIndex Score
2 records- 0154US12598821B2Chip package structure and method for producing the sameTONG HSING ELECTRONIC IND LTD·Filed 2023·Granted Apr 7, 2026·0 cites·13 claims
- 0245US12599045B2Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereofTONG HSING ELECTRONIC IND LTD·Filed 2023·Granted Apr 7, 2026·0 cites·9 claims
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