Assignee
TOPACIO RODEN R
CA·9 granted patents·8 pending applications·30 citations·filing 2008–2017
Top patents by PatentIndex Score
17 records- 0194US8647974B2Method of fabricating a semiconductor chip with supportive terminal padTOPACIO RODEN R·Filed 2011·Granted Feb 11, 2014·22 cites·24 claims
- 0281US9318457B2Methods of fabricating semiconductor chip solder structuresTOPACIO RODEN R·Filed 2015·Granted Apr 19, 2016·3 cites·20 claims
- 0369US9576923B2Semiconductor chip with patterned underbump metallization and polymer filmTOPACIO RODEN R·Filed 2014·Granted Feb 21, 2017·2 cites·15 claims
- 0464US9728518B2Interconnect etch with polymer layer edge protectionTOPACIO RODEN R·Filed 2014·Granted Aug 8, 2017·1 cites·19 claims
- 0564US8389340B2Methods of forming semiconductor chip underfill anchorsTOPACIO RODEN R·Filed 2011·Granted Mar 5, 2013·1 cites·14 claims
- 0663US8058108B2Methods of forming semiconductor chip underfill anchorsTOPACIO RODEN R·Filed 2010·Granted Nov 15, 2011·1 cites·10 claims
- 0754US10403589B2Interconnect etch with polymer layer edge protectionTOPACIO RODEN R·Filed 2017·Granted Sep 3, 2019·0 cites·14 claims
- 0850US9142520B2Methods of fabricating semiconductor chip solder structuresTOPACIO RODEN R·Filed 2011·Granted Sep 22, 2015·0 cites·16 claims
- 0947US8294266B2Conductor bump method and apparatusTOPACIO RODEN R·Filed 2011·Granted Oct 23, 2012·0 cites·15 claims
- 1046US2011057307A1Semiconductor Chip with Stair Arrangement Bump StructuresTOPACIO RODEN R·Filed 2009·Application pending·0 cites
- 1142US2010102457A1Hybrid Semiconductor Chip PackageTOPACIO RODEN R·Filed 2008·Application pending·0 cites
- 1242US2011222256A1Circuit board with anchored underfillTOPACIO RODEN R·Filed 2010·Application pending·0 cites
- 1340US2013256871A1Semiconductor chip device with fragmented solder structure padsTOPACIO RODEN R·Filed 2012·Application pending·0 cites
- 1439US2012261812A1Semiconductor chip with patterned underbump metallizationTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1539US2013113084A1Semiconductor substrate with molded support layerTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1638US2013147026A1Heatsink interposerTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1737US2012326299A1Semiconductor chip with dual polymer film interconnect structuresTOPACIO RODEN R·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →