Assignee
TRAN TU-ANH N
US·4 granted patents·2 pending applications·10 citations·filing 2006–2014
Top patents by PatentIndex Score
6 records- 0175US9111755B1Bond pad and passivation layer having a gap and method for formingTRAN TU-ANH N·Filed 2014·Granted Aug 18, 2015·4 cites·20 claims
- 0272US9780051B2Methods for forming semiconductor devices with stepped bond padsTRAN TU-ANH N·Filed 2013·Granted Oct 3, 2017·3 cites·19 claims
- 0371US9437574B2Electronic component package and method for forming sameTRAN TU-ANH N·Filed 2013·Granted Sep 6, 2016·3 cites·18 claims
- 0442US8556159B2Embedded electronic componentTRAN TU-ANH N·Filed 2012·Granted Oct 15, 2013·0 cites·20 claims
- 0541US2015303169A1Systems and methods for multiple ball bond structuresTRAN TU-ANH N·Filed 2014·Application pending·0 cites
- 0638US2007267748A1Integrated circuit having pads and input/output (i/o) cellsTRAN TU-ANH N·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →