Assignee
TRAUTMANN ACHIM
DE·3 granted patents·1 pending application·2 citations·filing 2008–2010
Top patents by PatentIndex Score
4 records- 0161US8638000B2Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chipTRAUTMANN ACHIM·Filed 2010·Granted Jan 28, 2014·2 cites·11 claims
- 0246US9111787B2Arrangement of two substrates having an SLID bond and method for producing such an arrangementTRAUTMANN ACHIM·Filed 2009·Granted Aug 18, 2015·0 cites·14 claims
- 0344US8405190B2Component having a silicon carbide coated viaTRAUTMANN ACHIM·Filed 2009·Granted Mar 26, 2013·0 cites·7 claims
- 0442US2010308475A1Composite of at least two semiconductor substrates and a production methodTRAUTMANN ACHIM·Filed 2008·Application pending·0 cites
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