Assignee

TRIPOD TECH CORP

TW·1 granted patent·16 citations·filing 2014–2014

Technology mixH01F1 H05K1 Y10T1

Top patents by PatentIndex Score

1 record

0183US9743523B2Printed circuit board package structure and manufacturing method thereofTRIPOD TECH CORP·Filed 2014·Granted Aug 22, 2017·16 cites·26 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →