Assignee
TRITON MICROTECHNOLOGIES
US·6 granted patents·107 citations·filing 2012–2014
Top patents by PatentIndex Score
6 records- 0195US9374892B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jun 21, 2016·32 cites·7 claims
- 0295US9236274B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jan 12, 2016·33 cites·3 claims
- 0393US9337060B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted May 10, 2016·18 cites·16 claims
- 0488US9184064B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·14 cites·20 claims
- 0585US9184135B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·10 cites·20 claims
- 0644US9111917B2Low cost and high performance bonding of wafer to interposer and method of forming vias and circuitsTRITON MICROTECHNOLOGIES·Filed 2012·Granted Aug 18, 2015·0 cites·10 claims
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