Assignee
TSAI CHIA-LUN
TW·9 granted patents·43 citations·filing 2008–2011
Top patents by PatentIndex Score
9 records- 0192US8399963B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Mar 19, 2013·14 cites·13 claims
- 0286US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0375US8823179B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2008·Granted Sep 2, 2014·5 cites·24 claims
- 0474US8384222B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2011·Granted Feb 26, 2013·3 cites·19 claims
- 0573US8431950B2Light emitting device package structure and fabricating method thereofTSAI CHIA-LUN·Filed 2009·Granted Apr 30, 2013·5 cites·10 claims
- 0671US9269732B2Chip packageTSAI CHIA-LUN·Filed 2010·Granted Feb 23, 2016·3 cites·16 claims
- 0767US8319347B2Electronic device package and fabrication method thereofTSAI CHIA-LUN·Filed 2009·Granted Nov 27, 2012·3 cites·28 claims
- 0859US7968448B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2009·Granted Jun 28, 2011·1 cites·2 claims
- 0948US8637970B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Jan 28, 2014·0 cites·15 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →