Assignee
TSAI KUN-CHEN
TW·2 granted patents·1 pending application·0 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0151US8302297B2Method of fabricating a circuit board structureTSAI KUN-CHEN·Filed 2009·Granted Nov 6, 2012·0 cites·13 claims
- 0234US8786108B2Package structureTSAI KUN-CHEN·Filed 2011·Granted Jul 22, 2014·0 cites·8 claims
- 0332US2012032282A1Microelectromechanical system (mems) carrier and method of fabricating the sameTSAI KUN-CHEN·Filed 2011·Application pending·0 cites
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