Assignee
TSUJINO MAHIRO
JP·4 granted patents·11 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0178US8653649B2Device housing package and mounting structureTSUJINO MAHIRO·Filed 2010·Granted Feb 18, 2014·10 cites·8 claims
- 0256US9491873B2Element housing package, component for semiconductor device, and semiconductor deviceTSUJINO MAHIRO·Filed 2012·Granted Nov 8, 2016·1 cites·6 claims
- 0338US9078347B2Electronic component housing unit, electronic module, and electronic deviceTSUJINO MAHIRO·Filed 2011·Granted Jul 7, 2015·0 cites·7 claims
- 0431US8952518B2Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the sameTSUJINO MAHIRO·Filed 2012·Granted Feb 10, 2015·0 cites·6 claims
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