Assignee
TTM ADVANCED CIRCUITS INC
US·8 granted patents·22 citations·filing 2001–2002
Top patents by PatentIndex Score
8 records- 0164US6814918B2Filling methodTTM ADVANCED CIRCUITS INC·Filed 2002·Granted Nov 9, 2004·9 cites·20 claims
- 0258US7066378B2Filling deviceTTM ADVANCED CIRCUITS INC·Filed 2002·Granted Jun 27, 2006·6 cites·11 claims
- 0354US6921505B2Hole filling using an etched hole-fill stand-offTTM ADVANCED CIRCUITS INC·Filed 2002·Granted Jul 26, 2005·4 cites·4 claims
- 0452US6840425B2Scavenging systemTTM ADVANCED CIRCUITS INC·Filed 2001·Granted Jan 11, 2005·3 cites·11 claims
- 0540US6832714B2Heated filling deviceTTM ADVANCED CIRCUITS INC·Filed 2001·Granted Dec 21, 2004·0 cites·3 claims
- 0640US6793852B2Scavenging methodTTM ADVANCED CIRCUITS INC·Filed 2001·Granted Sep 21, 2004·0 cites·7 claims
- 0734US6855385B2PCB support plate for PCB via fillTTM ADVANCED CIRCUITS INC·Filed 2002·Granted Feb 15, 2005·0 cites·6 claims
- 0834US6800232B2PCB support plate method for PCB via fillTTM ADVANCED CIRCUITS INC·Filed 2002·Granted Oct 5, 2004·0 cites·10 claims
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