Assignee

TU CHIA-WEI

TW·2 granted patents·75 citations·filing 2011–2012

Technology mixH10W2 H01L1 H10P1

Top patents by PatentIndex Score

2 records

0197US9196532B2Integrated circuit packages and methods for forming the sameTU CHIA-WEI·Filed 2012·Granted Nov 24, 2015·67 cites·20 claims
0287US8569886B2Methods and apparatus of under bump metallization in packaging semiconductor devicesTU CHIA-WEI·Filed 2011·Granted Oct 29, 2013·8 cites·20 claims

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