Assignee
TZU CHUNG-HSING
TW·2 granted patents·9 pending applications·3 citations·filing 2005–2015
Top patents by PatentIndex Score
11 records- 0173US9472493B1High heat-dissipation chip package structureTZU CHUNG HSING·Filed 2015·Granted Oct 18, 2016·3 cites·9 claims
- 0244US2007145605A1Chip packaging structure without leadframeTZU CHUNG-HSING·Filed 2007·Application pending·0 cites
- 0343US2010133671A1Flip-chip package structure and the die attach method thereofTZU CHUNG HSING·Filed 2009·Application pending·0 cites
- 0443US2010133668A1Semiconductor device and manufacturing method thereofTZU CHUNG HSING·Filed 2009·Application pending·0 cites
- 0542US2013070427A1Pre molded can packageTZU CHUNG HSING·Filed 2012·Application pending·0 cites
- 0639US2015195919A1Intelligent Power Module ProcessTZU CHUNG HSING·Filed 2014·Application pending·0 cites
- 0737US9520343B1Field-effect transistor structure for preventing from shortingTZU CHUNG HSING·Filed 2015·Granted Dec 13, 2016·0 cites·6 claims
- 0836US2013070424A1Molded can packageTZU CHUNG HSING·Filed 2012·Application pending·0 cites
- 0936US2006017146A1IC with stably mounted chipTZU CHUNG-HSING·Filed 2005·Application pending·0 cites
- 1035US2012103668A1Chip PackageTZU CHUNG HSING·Filed 2011·Application pending·0 cites
- 1129US2016284634A1Semiconductor transistor package structureTZU CHUNG HSING·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →