Assignee

UBLEDS CO LTD

TW·2 granted patents·1 citations·filing 2013–2014

Technology mixG02F1 G09F1 H01L1 H10H1 H10W1

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2 records

0147US8916902B2LED module packaging structure with an IC chipUBLEDS CO LTD·Filed 2013·Granted Dec 23, 2014·1 cites·8 claims
0238US9097917B2Electronic display screen modular unit structureUBLEDS CO LTD·Filed 2014·Granted Aug 4, 2015·0 cites·4 claims

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