Assignee
UESHIMA MINORU
JP·7 granted patents·1 pending application·7 citations·filing 2005–2012
Top patents by PatentIndex Score
8 records- 0168US8303735B2Lead-free low-temperature solderUESHIMA MINORU·Filed 2006·Granted Nov 6, 2012·3 cites·16 claims
- 0264US9185812B2Lead-free solder pasteUESHIMA MINORU·Filed 2006·Granted Nov 10, 2015·2 cites·6 claims
- 0359US8865062B2High-temperature lead-free solder alloyUESHIMA MINORU·Filed 2012·Granted Oct 21, 2014·1 cites·17 claims
- 0456US8975757B2Lead-free solder connection structure and solder ballUESHIMA MINORU·Filed 2009·Granted Mar 10, 2015·1 cites·20 claims
- 0548US8790472B2Process for producing a solder preform having high-melting metal particles dispersed thereinUESHIMA MINORU·Filed 2005·Granted Jul 29, 2014·0 cites·11 claims
- 0646US10354944B2Method for soldering surface-mount component and surface-mount componentUESHIMA MINORU·Filed 2010·Granted Jul 16, 2019·0 cites·4 claims
- 0746US9205513B2Bi—Sn based high-temperature solder alloyUESHIMA MINORU·Filed 2011·Granted Dec 8, 2015·0 cites·10 claims
- 0840US2008246164A1Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic ComponentUESHIMA MINORU·Filed 2005·Application pending·0 cites
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