Assignee
UHLIG ALBRECHT
DE·2 granted patents·1 pending application·4 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0160US9076773B2Wire bondable surface for microelectronic devicesUHLIG ALBRECHT·Filed 2012·Granted Jul 7, 2015·2 cites·2 claims
- 0253US8986789B2Stress-reduced Ni-P/Pd stacks for bondable wafer surfacesUHLIG ALBRECHT·Filed 2009·Granted Mar 24, 2015·2 cites·6 claims
- 0335US2005282308A1Organic electroluminescent display device and method of producing the sameUHLIG ALBRECHT·Filed 2005·Application pending·0 cites
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