Assignee

UNITED MICROELECTRONICSCORP

TW·1 granted patent·0 citations·filing 1995–1995

Technology mixH10B1 H10W1

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0118US5830772AMethod for fabricating isolating regions for buried conductorsUNITED MICROELECTRONICSCORP·Filed 1995·Granted Nov 3, 1998·0 cites·9 claims

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