Assignee
UNITED TEST AND ASSEMBLY CENTER LTD
SG·4 granted patents·6 citations·filing 2013–2016
Top patents by PatentIndex Score
4 records- 0173US9613877B2Semiconductor packages and methods for forming semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2013·Granted Apr 4, 2017·4 cites·18 claims
- 0267US9960130B2Reliable interconnectUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted May 1, 2018·2 cites·22 claims
- 0346US9472532B2Leadframe area array packaging technologyUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted Oct 18, 2016·0 cites·24 claims
- 0445US9842792B2Method of producing a semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2016·Granted Dec 12, 2017·0 cites·17 claims
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