Assignee
UNITIVE ELECTRONICS INC
US·5 granted patents·272 citations·filing 2000–2004
Top patents by PatentIndex Score
5 records- 0196US6492197B1Trilayer/bilayer solder bumps and fabrication methods thereforUNITIVE ELECTRONICS INC·Filed 2000·Granted Dec 10, 2002·128 cites·46 claims
- 0292US6418033B1Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute anglesUNITIVE ELECTRONICS INC·Filed 2000·Granted Jul 9, 2002·61 cites·57 claims
- 0386US7081404B2Methods of selectively bumping integrated circuit substrates and related structuresUNITIVE ELECTRONICS INC·Filed 2004·Granted Jul 25, 2006·56 cites·51 claims
- 0473US6666368B2Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetweenUNITIVE ELECTRONICS INC·Filed 2001·Granted Dec 23, 2003·17 cites·15 claims
- 0566US7032806B2Methods of positioning components using liquid prime movers and related structuresUNITIVE ELECTRONICS INC·Filed 2001·Granted Apr 25, 2006·10 cites·34 claims
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