Assignee
UNIVERSAL GLOBAL TECH SHANGHAI CO LTD
CN·4 granted patents·5 pending applications·0 citations·filing 2015–2025
Top patents by PatentIndex Score
9 records- 0161US2025132266A1Method of manufacturing semiconductor package structure and semiconductor package structureUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 0258US2025358991A1Preparation method for a selective electromagnetic shielding and an electronic productUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2025·Application pending·0 cites
- 0353US2025029905A1Structure of chip package integrated antenna and manufacturing method thereofUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2023·Application pending·0 cites
- 0447US2026040450A1Interposer and preparation method thereof, and a system-in-package structureUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2025·Application pending·0 cites
- 0544US2025385197A1Packaging method for generating partitioned em-shielding and an electronic packaging moduleUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2025·Application pending·0 cites
- 0635US10121684B2Manufacturing method, pickup method, equipment and EMI (electromagnetic interference) electromagnetic shielding layer manufacturing method of SiP (system in package) moduleUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2016·Granted Nov 6, 2018·0 cites·18 claims
- 0732US11348831B2Method of manufacturing a semiconductor unitUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2019·Granted May 31, 2022·0 cites·3 claims
- 0825US9860994B2Circuit boardUNIVERSAL GLOBAL TECH (SHANGHAI) CO LTD·Filed 2015·Granted Jan 2, 2018·0 cites·9 claims
- 0923US10247658B2Test jig for coating adhesion strengthUNIVERSAL GLOBAL TECH SHANGHAI CO LTD·Filed 2016·Granted Apr 2, 2019·0 cites·9 claims
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