Assignee
UYEMURA C & CO LTD
JP·25 granted patents·14 pending applications·597 citations·filing 1995–2015
Top patents by PatentIndex Score
39 records- 0194US7220347B2Electrolytic copper plating bath and plating process therewithUYEMURA C & CO LTD·Filed 2005·Granted May 22, 2007·27 cites·20 claims
- 0294US5910340AElectroless nickel plating solution and methodUYEMURA C & CO LTD·Filed 1997·Granted Jun 8, 1999·307 cites·2 claims
- 0385US6099713ATin-silver alloy electroplating bath and tin-silver alloy electroplating processUYEMURA C & CO LTD·Filed 1997·Granted Aug 8, 2000·71 cites·5 claims
- 0482US6273943B1Electroless composite Plating Solution and Electroless composite plating methodUYEMURA C & CO LTD·Filed 2000·Granted Aug 14, 2001·28 cites·8 claims
- 0581US9359676B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Jun 7, 2016·3 cites·12 claims
- 0681US9120113B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Sep 1, 2015·2 cites·7 claims
- 0777US7988842B2Continuous copper electroplating methodUYEMURA C & CO LTD·Filed 2008·Granted Aug 2, 2011·2 cites·4 claims
- 0877US6508927B2Tin-copper alloy electroplating bathUYEMURA C & CO LTD·Filed 1999·Granted Jan 21, 2003·45 cites·19 claims
- 0975US7892411B2Electrolytic copper plating processUYEMURA C & CO LTD·Filed 2008·Granted Feb 22, 2011·1 cites·4 claims
- 1074US7837840B2Surface treatment apparatus for small objectUYEMURA C & CO LTD·Filed 2007·Granted Nov 23, 2010·1 cites·20 claims
- 1173US9374913B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUYEMURA C & CO LTD·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 1271US7678183B2Electroless palladium plating bath and electroless palladium plating methodUYEMURA C & CO LTD·Filed 2006·Granted Mar 16, 2010·9 cites·11 claims
- 1368US8015983B2Surface treatment apparatusUYEMURA C & CO LTD·Filed 2009·Granted Sep 13, 2011·0 cites·15 claims
- 1468US5803957AElectroless gold plating bathUYEMURA C & CO LTD·Filed 1997·Granted Sep 8, 1998·36 cites·3 claims
- 1566US7938914B2Workpiece surface treatment systemUYEMURA C & CO LTD·Filed 2008·Granted May 10, 2011·0 cites·4 claims
- 1666US6162343AMethod of preparing hard disc including treatment with amine-containing zincate solutionUYEMURA C & CO LTD·Filed 1998·Granted Dec 19, 2000·27 cites·2 claims
- 1763US9242281B2Workpiece surface treatment systemUYEMURA C & CO LTD·Filed 2014·Granted Jan 26, 2016·0 cites·1 claims
- 1862US6790331B2Electrodeposition coating film thickness calculating method, recording medium stored with film thickness calculating program and readable by means of computer, and electrodeposition coating film thickness simulation apparatusUYEMURA C & CO LTD·Filed 2002·Granted Sep 14, 2004·7 cites·7 claims
- 1961US7090564B2Polishing solution and method of polishing nonferrous metal materialsUYEMURA C & CO LTD·Filed 2004·Granted Aug 15, 2006·4 cites·20 claims
- 2058US8372259B2Method of preparing chromium plating bath and method of forming plating filmUYEMURA C & CO LTD·Filed 2009·Granted Feb 12, 2013·0 cites·6 claims
- 2158US7506742B2Board unloading device and board unloading methodUYEMURA C & CO LTD·Filed 2006·Granted Mar 24, 2009·4 cites·17 claims
- 2257US2008169267A1Solution for removing aluminum oxide film and method for surface treatment of aluminum or aluminum alloyUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 2356US7988773B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Aug 2, 2011·0 cites·11 claims
- 2454US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 2554US2007221506A1Electroplating methodUYEMURA C & CO LTD·Filed 2007·Application pending·0 cites
- 2653US2014242288A1Reducing electroless silver plating solution and reducing electroless silver plating methodUYEMURA C & CO LTD·Filed 2012·Application pending·0 cites
- 2752US2009133782A1Solution for processing of metal replacement with metal aluminum or aluminum alloy and method for surface processing using such solutionUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 2850US2009092749A1Manufacture method of buildup circuit boardUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 2950US2013295294A1Electroless copper plating bath and electroless copper plating methodUYEMURA C & CO LTD·Filed 2012·Application pending·0 cites
- 3049US2015289382A1Production method for printed wiring board and printed wiring board produced by said methodUYEMURA C & CO LTD·Filed 2013·Application pending·0 cites
- 3148US5858073AMethod of treating electroless plating bathUYEMURA C & CO LTD·Filed 1997·Granted Jan 12, 1999·14 cites·5 claims
- 3248US2008173550A1Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performanceUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 3347US2007108044A1Plating tankUYEMURA C & CO LTD·Filed 2006·Application pending·0 cites
- 3442US2011214994A1Pretreating agent for electroplating, pretreatment method for electroplating, and electroplating methodUYEMURA C & CO LTD·Filed 2011·Application pending·0 cites
- 3538US2011056840A1Electrolytic plating equipment and electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
- 3636US5577949ABuffing methodUYEMURA C & CO LTD·Filed 1995·Granted Nov 26, 1996·6 cites·8 claims
- 3736US2011146732A1Workpiece Surface Treatment SystemUYEMURA C & CO LTD·Filed 2011·Application pending·0 cites
- 3836US2011089044A1Copper electrolytic plating bath and copper electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
- 3923US2015267310A1Tin or tin alloy electroplating bath and process for producing bumps using sameUYEMURA C & CO LTD·Filed 2015·Application pending·0 cites
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