Assignee
UZOH CYPRIAN EMEKA
US·7 granted patents·1 pending application·545 citations·filing 2008–2018
Top patents by PatentIndex Score
8 records- 0198US8076237B2Method and apparatus for 3D interconnectUZOH CYPRIAN EMEKA·Filed 2008·Granted Dec 13, 2011·536 cites·42 claims
- 0285US8772946B2Reduced stress TSV and interposer structuresUZOH CYPRIAN EMEKA·Filed 2012·Granted Jul 8, 2014·6 cites·83 claims
- 0371US9184323B2Method and substrates for making photovoltaic cellsUZOH CYPRIAN EMEKA·Filed 2011·Granted Nov 10, 2015·1 cites·15 claims
- 0466US2018158972A1Method and substrates for material applicationUZOH CYPRIAN EMEKA·Filed 2018·Application pending·0 cites
- 0564US9905713B2Method and substrates for material applicationUZOH CYPRIAN EMEKA·Filed 2011·Granted Feb 27, 2018·1 cites·12 claims
- 0663US8785790B2High strength through-substrate viasUZOH CYPRIAN EMEKA·Filed 2011·Granted Jul 22, 2014·1 cites·46 claims
- 0762US10333014B2Method and substrates for making photovoltaic cellsUZOH CYPRIAN EMEKA·Filed 2015·Granted Jun 25, 2019·0 cites·13 claims
- 0850US8946899B2Via in substrate with deposited layerUZOH CYPRIAN EMEKA·Filed 2012·Granted Feb 3, 2015·0 cites·13 claims
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