Assignee
VIKING COMPONENTS
US·3 granted patents·329 citations·filing 1998–1999
Top patents by PatentIndex Score
3 records- 0193US6222739B1High-density computer module with stacked parallel-plane packagingVIKING COMPONENTS·Filed 1999·Granted Apr 24, 2001·247 cites·43 claims
- 0279US6160718AMulti-chip package with stacked chips and interconnect bumpsVIKING COMPONENTS·Filed 1998·Granted Dec 12, 2000·76 cites·23 claims
- 0329US6094355AHigh-density computer modules with double-layer packagingVIKING COMPONENTS·Filed 1998·Granted Jul 25, 2000·6 cites·27 claims
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