Assignee
VINVENTIONS USA LLC
US·8 granted patents·4 pending applications·4 citations·filing 2015–2022
Top patents by PatentIndex Score
12 records- 0183US11465325B2Method for manufacturing a closure for a product-retaining containerVINVENTIONS USA LLC·Filed 2018·Granted Oct 11, 2022·2 cites·43 claims
- 0279US11697283B2Mounting device for receiving a hollow cylindrical object and printing systemVINVENTIONS USA LLC·Filed 2019·Granted Jul 11, 2023·2 cites·27 claims
- 0374US12023839B2Method for manufacturing a closure for a product-retaining containerVINVENTIONS USA LLC·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 0473US12151853B2Method for manufacturing a closure for a product-retaining containerVINVENTIONS USA LLC·Filed 2022·Granted Nov 26, 2024·0 cites·46 claims
- 0561US2022017268A1Closure for a product-retaining containerVINVENTIONS USA LLC·Filed 2021·Application pending·0 cites
- 0660US11565853B2Method for manufacturing a closure for a product-retaining containerVINVENTIONS USA LLC·Filed 2018·Granted Jan 31, 2023·0 cites·53 claims
- 0754US11724861B2Decorative closure for a containerVINVENTIONS USA LLC·Filed 2019·Granted Aug 15, 2023·0 cites·56 claims
- 0843US2019135498A1Method for manufacturing coated particlesVINVENTIONS USA LLC·Filed 2018·Application pending·0 cites
- 0942US2019135499A1Thermoplastic material and use thereof in the production of a cork composite materialVINVENTIONS USA LLC·Filed 2018·Application pending·0 cites
- 1042US2019136063A1Particulate material for use in the production of a cork composite material or an article of manufacture comprising corkVINVENTIONS USA LLC·Filed 2018·Application pending·0 cites
- 1141US11571912B2Tiltable mounting device, printing system and method for printing on cylindrical objectsVINVENTIONS USA LLC·Filed 2019·Granted Feb 7, 2023·0 cites·27 claims
- 1231US10286586B2Multi-component synthetic closure and method of manufacture thereofVINVENTIONS USA LLC·Filed 2015·Granted May 14, 2019·0 cites·30 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →