Assignee
VIRTUAL INTEGRATION INC
US·1 granted patent·1 pending application·125 citations·filing 1999–2001
Top patents by PatentIndex Score
2 records- 0190US6294407B1Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the sameVIRTUAL INTEGRATION INC·Filed 1999·Granted Sep 25, 2001·125 cites·10 claims
- 0236US2003038378A1Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias thereinVIRTUAL INTEGRATION INC·Filed 2001·Application pending·0 cites
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