Assignee
WALTON ADVANCED ENG INC
TW·29 granted patents·55 pending applications·289 citations·filing 2003–2025
Top patents by PatentIndex Score
84 records- 0197US6763410B2Portable universal serial bus memory deviceWALTON ADVANCED ENG INC·Filed 2003·Granted Jul 13, 2004·174 cites·9 claims
- 0289US7887342B1Structure having an USB memory moduleWALTON ADVANCED ENG INC·Filed 2010·Granted Feb 15, 2011·12 cites·17 claims
- 0387US7903408B1Heat dissipation device of electronic circuit modulesWALTON ADVANCED ENG INC·Filed 2009·Granted Mar 8, 2011·16 cites·50 claims
- 0486US10515236B1Data retention deviceWALTON ADVANCED ENG INC·Filed 2019·Granted Dec 24, 2019·5 cites·7 claims
- 0586USD737820SNetwork storage deviceWALTON ADVANCED ENG INC·Filed 2014·Granted Sep 1, 2015·36 cites·1 claims
- 0685US7270557B1High-density storage deviceWALTON ADVANCED ENG INC·Filed 2006·Granted Sep 18, 2007·15 cites·9 claims
- 0770US7413470B1Modular assembly of memory module packagesWALTON ADVANCED ENG INC·Filed 2007·Granted Aug 19, 2008·5 cites·6 claims
- 0869US7768112B2Semiconductor package fabricated by cutting and molding in small windowsWALTON ADVANCED ENG INC·Filed 2009·Granted Aug 3, 2010·4 cites·7 claims
- 0968US8770997B2Foldable USB connectorWALTON ADVANCED ENG INC·Filed 2012·Granted Jul 8, 2014·6 cites·12 claims
- 1066US7723157B2Method for cutting and molding in small windows to fabricate semiconductor packagesWALTON ADVANCED ENG INC·Filed 2007·Granted May 25, 2010·3 cites·13 claims
- 1162US7311460B2Digital data storage device mounted in a pen shaped housingWALTON ADVANCED ENG INC·Filed 2003·Granted Dec 25, 2007·9 cites·9 claims
- 1262US2026076220A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 1362US2026068696A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 1461US2025349767A1Semiconductor package structure with improved die pad and method thereofWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 1558US2024421137A1Chip package unit, chip package stack module, and method of manufacturing chip package stack moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 1658US2024321653A1Wafer package for protection of aluminum die pad of die from damages during probe testing processWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 1757US12355730B2Method for construction of a high-security private group networkWALTON ADVANCED ENG INC·Filed 2023·Granted Jul 8, 2025·0 cites·8 claims
- 1857US8361841B2Mold array process method to encapsulate substrate cut edgesWALTON ADVANCED ENG INC·Filed 2011·Granted Jan 29, 2013·1 cites·14 claims
- 1957US7795720B1Inversely alternate stacked structure of integrated circuit modulesWALTON ADVANCED ENG INC·Filed 2009·Granted Sep 14, 2010·1 cites·27 claims
- 2057US2024266239A1Chip package unit with outer protective layer and method of manufactuirng the sameWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2157US2024260195A1Embedded dual in-line memory moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2257US2026026414A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2357US2026018505A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2456US12568847B2Chip package and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Granted Mar 3, 2026·0 cites·6 claims
- 2556US12532760B2Chip package unit, method of manufacturing the same, and package structure formed by stacking the sameWALTON ADVANCED ENG INC·Filed 2023·Granted Jan 20, 2026·0 cites·6 claims
- 2656US7957130B2Attached-type memory deviceWALTON ADVANCED ENG INC·Filed 2009·Granted Jun 7, 2011·2 cites·7 claims
- 2756US2024243075A1Chip package with heat dissipation and electromagnetic protectionWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 2856US2026011675A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 2956US2024162164A1Chip package with metal shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3055US2024372902A1Metaverse Implementation MethodWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 3155US2020265434A1Transaction authentication methodWALTON ADVANCED ENG INC·Filed 2019·Application pending·0 cites
- 3255US2024120300A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3355US2020264793A1Method to change the capacity of a storage deviceWALTON ADVANCED ENG INC·Filed 2019·Application pending·0 cites
- 3455US2024088057A1Chip package with electromagnetic interference (emi) shielding layer and ground wire and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3555US2024096758A1Chip package having die pad with protective layerWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3655US2024145404A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3754US12512448B2Multi-layer stacked chip packageWALTON ADVANCED ENG INC·Filed 2023·Granted Dec 30, 2025·0 cites·5 claims
- 3854US12482771B2Chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Granted Nov 25, 2025·0 cites·6 claims
- 3954US11587854B2System in packageWALTON ADVANCED ENG INC·Filed 2021·Granted Feb 21, 2023·0 cites·8 claims
- 4054US11036893B2Data retention methodWALTON ADVANCED ENG INC·Filed 2019·Granted Jun 15, 2021·0 cites·8 claims
- 4154US2024047375A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4254US2024063138A1Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4354US2025096150A1Anti-electromagnetic interference wafer structureWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4454US2025372562A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4554US2025379178A1Module containing fan-out wafer-level packaging (fowlp) unit connected to electronic component by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 4654US2023411317A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4754US2023395537A1Bump of chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4854US2024021552A1Chip package unit, method of manufacturing the same, and package structure formed by stacking the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4954US2025391799A1Fan-out wafer level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 5053US11869876B2Thinning system in packageWALTON ADVANCED ENG INC·Filed 2021·Granted Jan 9, 2024·0 cites·10 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when WALTON ADVANCED ENG INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →